Most Popular

PCB Design & Layout

From schematic to fabrication-ready Gerbers

We design production-quality PCBs — from single-layer sensor boards to 8-layer high-speed mixed-signal systems. Every layout is optimized for signal integrity, manufacturability, and cost before it ever reaches the fab house.

KiCAD & Altium DesignerUp to 8 layersHigh-speed signal integrityImpedance controlled tracesMixed signal designsDFM optimization

Multi-Layer & Rigid-Flex Design

Not all products fit on a 2-layer board. We design up to 8-layer rigid and rigid-flex PCBs (including 4+2 configurations) for space-constrained wearables, folded enclosures, and dense mixed-signal systems. Stackup design, impedance planning, and controlled-length routing are handled from day one — not patched in later.

  • 2-layer to 8-layer stackup design
  • Rigid-flex (4+2) for compact wearables and foldable assemblies
  • Impedance-controlled differential pairs and single-ended traces
  • Defined reference planes and return-current paths on every layer

High-Speed & Mixed-Signal Integrity

High-speed interfaces like USB, SDIO, SPI at >40 MHz, and camera buses require precise trace length matching, controlled impedance, and clean return paths. We handle signal integrity from the schematic stage — choosing proper termination, guard traces, and via stitching strategies so the board works the first time.

  • Differential pair routing (USB, Ethernet, LVDS)
  • Length-matched buses for cameras, SDRAM, and displays
  • Guard traces and via stitching for noise-sensitive analog sections
  • Proper decoupling strategy — placement, value, and via connection

Design for Manufacturability (DFM)

A beautiful layout that can't be reliably manufactured is useless. Every design we deliver is checked against real fab and assembly constraints — minimum annular rings, solder mask dams, component courtyard clearances, and panel utilization. We also verify component availability and suggest drop-in alternates where lead times are risky.

  • Fab-house DRC with real vendor rules (JLCPCB, PCBWay, etc.)
  • Component availability and alternate sourcing verification
  • BOM cost optimization without sacrificing performance
  • Proper thermal relief and copper balancing for reliable reflow

Power Integrity & Thermal Management

Power delivery is as important as signal routing. We design PDN (Power Distribution Networks) with proper plane splits, decoupling placement strategies, and copper pours sized for actual current loads. For high-power designs, thermal vias, heatsink pad exposure, and copper balancing are part of the layout — not bolt-on fixes.

  • PDN analysis and plane-split strategies
  • Thermal via arrays under power components and exposed pads
  • Copper balancing for uniform reflow and reduced board warp
  • Current-carrying capacity verified for all traces and vias

Tools & Technologies

KiCAD 8
Altium Designer
JLCPCB / PCBWay DRC rules
Saturn PCB Toolkit
IPC-2221 / IPC-7351 standards

Frequently Asked Questions

How many layers do I need for my project?

It depends on the signal count, speed requirements, and form factor. Simple microcontroller boards work on 2 layers. Mixed-signal designs with USB, cameras, or RF typically need 4 layers. Dense designs with DDR, Ethernet, or rigid-flex constraints may need 6–8 layers. We'll recommend the optimal layer count during the initial review.

Do you deliver Gerber files ready for fabrication?

Yes. Every project includes fabrication-ready Gerbers, drill files, BOM, and centroid/pick-and-place files. We also provide the source KiCAD or Altium project so you own the design completely.

Can you review an existing PCB layout?

Absolutely. We offer PCB design reviews covering signal integrity, power integrity, DFM issues, and cost optimization — ideal before committing to a fabrication run.

Need pcb design & layout for your project?

Let’s discuss your requirements and find the best approach for your hardware project.